(A) Cathodic protection
(B) Anodic protection
(C) Usage of largest possible anodic area
(D) Any one of these

(A) Perspex (PMMA)
(B) Teflon (PTFE)
(C) Bakelite (phenol formaldehyde)
(D) Polystyrene

(A) Unsteady uniform
(B) Unsteady non-uniform
(C) Steady uniform
(D) Steady non-uniform

(A) Linear displacement
(B) Concavity/convexity
(C) Surface texture
(D) Flatness

(A) Vickers hardness test
(B) Shore scleroscope test
(C) Brinell hardness test
(D) Rockwell hardness test

(A) Improve machinability & tensile strength
(B) Remove internal stresses
(C) Refine the structure
(D) Remove strains caused by cold working

(A) Weaker in tension but stronger in shear
(B) Weaker in shear but stronger in tension
(C) Stronger in both shear and tension
(D) The lap joints are easily made

(A) Wet steam
(B) Saturated steam
(C) Superheated steam
(D) Saturated water

(A) Electronic
(B) Structural
(C) Process
(D) Heavy

(A) Increases
(B) Decreases
(C) Remain constant
(D) Either (A) or (B), depends on the type of semi-conductor